Month: July 2025

Up to 24 GB HBM2

Samsung on Monday said that it had developed the industry’s first 12-layer 3D packaging for DRAM products. The technology uses through silicon vias (TSVs) to create high-capacity HBM memory devices for applications that benefit from high memory bandwidth and capacities, such as higher-end graphics, FPGAs, and compute cards. Samsung’s 12-layer […]

Saramonic Partners With Benro and Introduces DIY Content Creation Kit: Roadieographer

Chinese camera accessories brand Benro and American audio gear manufacturer Saramonic partnered and introduced a new series of content creation kit that turns your camera or smartphone into a mobile studio: Roadieographer. For providing all-in-one solution to content creators, musicians and bands, Saramonic partnered with Benro and released three new […]